R. Zainul, B. Oktavia, I. Dewata, J. Efendi
The copper oxide plate has been used as a visible light photovoltaic panel material. In this research, the process of forming copper oxide on the surface of the copper thin plate is examined. The method used is the thermal oxidation of the copper plate with a thickness of 200-250 μm. Surface evaluation and internal morphological studies of the oxide synthesis process are carried out using SEM, XRD and DTA. DTA analysis results provide information that the process of plating copper plate structure occurs at 370.44 C. XRD analysis on thin oxide plate calcined at 380 C for 1 hour, formed 92.6% Cu 2 O and 6.4% CuO. Analysis of surface and morphology, the optimum oxide region formed at 25 μm thickness and internal oxygen attack re aches a maximum depth of 129 μm. The size of the copper oxide aggregate is formed in a nano multiscale particle between 300 - 800 nm. © Published under licence by IOP Publishing Ltd.
Physical Chemistry Laboratory, FMIPA, Universitas Negeri Padang, Indonesia; Analytical Chemistry Laboratory, FMIPA, Universitas Negeri Padang, Indonesia; Environmental Chemistry Laboratory, FMIPA, Universitas Negeri Padang, Indonesia; Inorganic Chemistry Laboratory, FMIPA, Universitas Negeri Padang, Indonesia
